Disco wafer backgrind. Phone +49 89 909 03-0 Fax +49 89 909 03-199.

Disco wafer backgrind The TAIKO process is the name of a wafer back grinding process. Process of semiconductor packaging Please check training material from DISCO More stable Z2-axis grindability is achieved by matching the Z1 and Z2-axis grinding points. Mechanical Dummy Si silcon wafers: mirrored, polished or with etched patterns. With two-spindle, two-chuck table specifications and a robot arm, the Disco 840 and 841 machines feature a same-cassette return function. We are the authorised distrubutor for DENKA JAPAN. Because the contact length between the grinding wheel and silicon wafer is constant, the TTV of wafers ground by in-feed grinders is significantly improved [35]. Inherited grinding specifications with an established reputation the Wafer Edge with edge trimming. Dicing-Grinding Service. • 8,000 wafers/month wafer backgrind capacity and 12-inch wafers) for backgrinding, polishing, and dicing manufactured by our exclusive partner, DISCO Japan Types of Wafers We Can Back Grind. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment. This contributes to a shorter thin wafer processing time (compared to the DGP8760). DISCO’s fixed abrasive, dual step grinding process is able to achieve excellent thickness tolerances and the fine grind wheel can control surface roughness to a nanometer scale. The tape can be removed prior shipping out to the customer or it remains on the wafer to protect the surface and prevents breaking during transport. Disco DFG841 Wafer Back Grinder in a working 200mm wafer fab - available July 2024. Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. Investor relations, careers, and DISCO corporate information is also available. the Wafer Edge without edge trimming. To protect the wafer front side, it will be temporarily covered with a UV curable grinding tape. 1 A TAIKO wafer which is usable as a handling jig Applications example Accreditations & Certs. Double pass or “step” cutting ensures high quality and accurate SiC, fused silica, quartz, and silicon wafer dicing. com 34 carrier die die Remove PR Laser mark CSP singulation Wafer Backgrind. By leaving this edge ring, it is possible to reduce the risks of wafer breakage or edge chipping. 025mm (0. dgs@discoeurope. Subsequently, in back-end production, the wafer backside is thinned and the wafer is singulated by dicing. Daisy chain available. With our advanced wafer processing equipment, QP Technologies offers expert backgrinding services for wafer-level packaging or other packaging requiring thin and ultra-thin (<100 um) die. Liebigstrasse 8 D-85551 Kirchheim b. We offer wheels on all the machine tool platforms being used by the industry. This process method leaves a ring (approximately 3 mm) on the wafer outer edge and thin grinds only the inner area of the backside wafer. Since the number of laser pulses needed to divide a wafer into chips differs depending on the chip thickness, the 110 and 350 µm chips were irradiated by three and six passes, respectively. Disco develops fully automatic grinder for 100-200mm Si and SiC wafers. [4] The wafer proceeds to Z2 for fine grinding. We have over 15 years of silicon wafer thinning and wafer backgrinding experience, including bumped wafer backgrinding and have provided wafer backgrind services since 1997. What is the Process to Backgrind Silicon Wafers? By using inner circumference of this wafer like a "Plate", even a 4-inch or 6-inch wafer can be handled as an 8-inch wafer. DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. For experimental use in the lab for dicing practice, pick and place, wire-bonding practice. IGBT Si GaN and SiC wafer with back metal plating. DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. By using inner circumference of this wafer like a "Plate", even a 4-inch or 6-inch wafer can be handled as an 8-inch wafer. Europe. TAIKO process. München Germany. 1 A TAIKO wafer which is usable as a handling jig Applications example [1]The robot pick removes the wafer from the cassette and places on the positioning table, where centering takes place. We backgrind to thickness you require. Products Related. The procedure comprises the thinning of silicon wafers by scraping out material from the backside, which is crucial for enhancing the functionality and dependability of semiconductor devices. If a rigid handle wafer is used, the backgrind tape is not necessary and the wafer stack is placed with the handle wafer on the holding chuck such that the backside of the device wafer is facing up. Wafer or singulated sawn die. Introduction to DISCO's advanced Kiru・Kezuru・Migaku technologies, including precision processing equipment, precision processing tools, and peripheral equipment. jp/eg/support/term/doc/Pr Disco DFG 8540, Disco 850, DAG 810, Gigamat polishers GDSI recommends FRT of America for your wafer measurement applications, performed with non-contact technology. Based on the wafer type to be ground, we offer a variety of coarse wheels to suit specific needs. Our precise back grinding techniques ensure uniform thickness and exceptional flatness for optimal device performance. Click to Contact Seller. Also patterned wafers can be processed. 0”) in diameter with exceptional precision and repeatability. This unevenness transfers to the wafer after grinding, which may deteriorate TTV. When processing down to a thickness of several hundred microns, more than 100 μm thick, the risk of wafer breakage is not so high. com Dec 15, 2022 · News: Suppliers 15 December 2022. We can take your wafers and backgrind to expose heat sinks, anodes, cathodes and other I/O on the bottoms (or tops) of your chip-scale packages. 020mm (0. . When attaching a BG tape on a wafer having a large unevenness in its pattern, the BG tape surface becomes uneven. 1 Appearance inspection The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. Download scientific diagram | Wafer thinning mark on backside of wafer (Courtesy of Disco Corporation) from publication: Ultra-thin Die Characterization for Stack-die Packaging | On both the •Single silicon polishing with standard DISCO/CMP toolset. Since thinned large-diameter wafers have a high risk of wafer-level breakage, various preventive measures are required for processing. The need for thinner chips has been growing in recent years to support lower package heights and allow This unit features two-spindle, three-rotary-chuck table specifications, allowing high-quality ultra-thin grinding for thin wafers 3D integration, bonded wafers, etc. 2. All the Disco, Okamoto (Shibiyama), TSK, G&N & Strasbaugh models are covered under the Norton Winter availability. Specifications. The DFG8560 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8160) for in-line processing solutions. To use these DISCO blades and wheels (hereafter precision tooling) safely Please read carefully and follow the instructions below to prevent any accidents or injuries. 0008”) and up to 300mm (12. Dec 6, 2019 · Used DISCO DFG8540 Back Grinder for sale - Initializing the Back Grinder. Design flexibility. This article examines the wafer backgrinding procedure, its difficulties The most common grinding wheel is a high-speed circular rotary table. Disco DFG8540 wafer back grinder Advanced handling systems and design features facilitate high yield for thin wafer grinding. TCV Through ceramic DISCO DCS1440 Cleaning 8 Inch Transparent UV curable or standard adhesive backgrinding tape is temporarily applied to protect your silicon wafers from damage during wafer grinding. 2016 3 (Ni-Ti) alloy layer was formed on the wafer backside. After the device side of the wafer is bonded to the first support substrate where the temporary bond In silicon semiconductor manufacturing, Φ300 mm wafers are increasingly becoming mainstream to improve productivity. • Opportunity#1 Standard edge and backside trim tools are available. -- CORWIL Technology Corporation recently announced the expansion of its wafer thinning services with the addition of a Disco DAG 810 automatic grinder. 7 In-feed type wafer backgrinding where is the feed rate, ω1 is the chuck rotational speed and ω2 is the wheel rotational speed. QP Technologies can backgrind wafers up to 300mm in diameter, as well as partial wafers, bumped wafers and even individual die. Wafer Polishing DFM2800 Grinder/Polisher Realizes faster processing of ultrathin wafers Φ300 mm DBG SDBG Wafer Thinning Realizes high yield thin wafer processing The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. This tool can process sample pieces to 8 inch wafers. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. Superior finishing quality; Long-life specification - high wear resistance; Large product range - able to process compound semiconductor wafers and crystal materials Aug 30, 2020 · The wafer passes rough and fine grinding steps that reduces the thickness of the wafer as required. It is also possible to provide these services with machines that are not shown here. Aug 22, 2020 · [Eng Sub] Wafer Backgrinding Process: Wafer thinning, Wafer lapping. DISCO delivers complete ultra-thin grinding solutions that comprise four key elements: machine, grinding wheel, protective tape, and processing conditions. [2] The T1 arm places the wafer on the chuck table. Intech is equipped to handle various types of wafers for back grinding, including: Silicon Wafer. The effects of thinning were evaluated using 180-nm node FRAM, 45-nm node HP logic, and 40-nm node DRAM wafers. Improving Die Strength (Stress Relief) The processing quality of ultra-thin finishing grinding can also be improved by using the Poligrind wheel, but a layer of powder (albeit slight) remains on the wafer surface due to processing using a grinding wheel. In addition, wafers are thinned to approximately 100 μm for high-profile packaging. This high demand has in turn made the processing of thin wafers an essential competence for many device manufacturers. Apr 1, 2014 · This paper describes wafer-on-wafer (WOW) technology using bumpless through-dielectrics-silicon-via (TDSV) and dual-damascene interconnects for three-dimensional integration (3DI). 3. Phone +49 89 909 03-0 Fax +49 89 909 03-199. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding. disco. Please confirm the product specifications with a DISCO representative. In addition, DISCO offers applications and IF Series wheels to match virtually any wafer size or processing requirement. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. This reduces total thickness variation on the wafer as well as wafer to wafer thickness variation, contributing to more stable thinning quality. • Cost • Edge Trim DISCO DFD6860, Wafer Backside Grind/Thinning DISCO DGP8761 HC • Supplier Landscape • Current Suppliers: DISCO Planarization Polishing Please confirm the product specifications with a DISCO representative. Quality Assurance is smart business for both the customer and supplier alike. USE a safety cover (nozzle case, cover), equipped as a standard accessory, to avoid injury. We can dice wafers as thin as 0. DFG8560 Grinders Supports advancements for thinner and larger wafers Φ300 mm 2 axes, 3 chuck tables DBG Wafer Thinning Inherited grinding specifications with an established reputation DFG8560 is the successor to the DFG800 series, equipment used by premier manufacturers worldwide. The TAIKO process is a wafer backgrinding method developed by DISCO. DISCO Technical Review Mar. A grinding wheel/disk with embedded diamonds performs the grinding itself. Wafers can be supplied by the customer or us. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process. DISCO Backgrinder, DAG810, can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This introduces the equipment that will be used for the Dicing and Grinding Service at the DISCO HI-TEC SINGAPORE (Singapore), DISCO HI-TEC EUROPE (Munich), DISCO HI-TEC CHINA (Shanghai), DISO HI-TEC TAIWAN (Taipei) and DISCO HI-TEC AMERICA(San Jose). In this case, it is possible to improve TTV after grinding by planarizing the uneven BG tape surface. Silicon wafers are the most common substrate used in semiconductor manufacturing. Product Information. Advanced handling systems and design features facilitate high yield for thin wafer grinding. Fig. The wafers are ground on the backside of the semiconductor circuit pattern, hence the name “back grinding” (BG) for this process. [3] The wafer proceeds to Z1 for rough grinding. The edge profile must be consistent with the SEMI M1-0707 standard to ensure proper sizing and bonding. NCG measure wafer thickness without contact, and has advantage below. Semiconductor packaging process technology to reduce package thicknessPlease check training material from DISCOhttps://www. Nov 21, 2024 · Backgrinding, wafer grinding, or wafer thinning technology makes possible the necessary reduction in wafer thickness necessary for improved chip performance in today’s leading-edge technology. To provide the processing results that these companies require, DISCO continuously researches and develops the machines, blades, and applications that make thin wafer dicing a reality. At SEMICON Japan 2022 at Tokyo Big Sight (14-16 December), Tokyo-based equipment maker DISCO Corp – which makes semiconductor manufacturing equipment including chemical mechanical polishing (CMP) systems and laser-based ingot slicing equipment and processes – is exhibiting the new Standard Backgrind. The DFG8540 can be integrated with DISCO's Dicing Before Grinding (DBG) system as well as polishers (DFP8140) for in-line processing solutions. 001”) Single die, partial wafer, or bumped wafer backgrinding Please confirm the product specifications with a DISCO representative. Nov 15, 2013 · Original Press Release: CORWIL Announces the Addition of a New 300mm Backgrind System MILPITAS, Calif. This tool will backgrind silicon wafers and achieve the desired shape of the edges. So that all kinds of different diameter wafer could be handling without changing the handling parts. DISCO HI-TEC EUROPE GmbH. We carries UV dicing tape, Backgrind tape. Disco’s Poligrind wheel technology reduces surface roughness, improves die strength, and reduces wafer warpage. Wafer Polishing Device wafer thinning and evaluation flow using the wafer-on-a-wafer (WOW) process is introduced in this section (Fig. Taiko process is a wafer backgrinding method developed by DISCO as a solution to solve the wafer handling and edge chipping challenges in conventional grinding process. The chips are then encapsulated in a package that will be delivered to end-users. If you have any question, please contact this email address : james@asesemiconductor Jan 1, 2008 · The wafer is then loaded face-down onto the backgrind table. Like any worthwhile investment with promises of a future return, GDSI has invested heavily in the establishment of a “quality” culture defined by our Quality Management System or “QMS”. Our capabilities include: Thin wafers from 4” to 8” diameter; Backgrinding to target thickness of 0. This method is different to conventional back grinding. Avoidance wafer breakage risk by the thickness measurement formed on the surface of a silicon wafer. 6) [6]. [5] The wafer proceeds to Z3 for dry polishing (or ultra-high-mesh wheel Wafer backgrinding/thinning porous chuck refurbishing ,new make or modifcation . Trusted Seller. co. Axus Technology can help you choose the right wafer grinding equipment to provide precise control, exacting dimensions, and challenging specification Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. com DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. Silicon wafer PR pattern PR carrier die die After Plasma etch PR Plasma singulation Wafer Backgrind Bond to carrier wafer Encapsulatie around dies Carrier removal Wafer probe Sept 28, 2017 Annetteteng@promex-ind. Jul 11, 2023 · Wafer backgrinding is a crucial step in semiconductor manufacturing, as it prepares the wafer for further processing and packaging. Automated Wafer Dicing. Coarse Grind. vlfrl xwtr qugr wrj gmpz mirczs qejvadhzf iwuzk pvkwnnk vwshsw